Visual inspection
The IRDM PRO is the high end DDR4 memory lineup offered by the Polish manufacturer GOODRAM. Compared to the gaming RAM kits series, the IRDM X, the Pro variant have an elegant design and is only available in a single color.
The main design theme of the IRDM Pro is the all black glossy finish of the heatsink, with subtle gold accents placed all around the RAM module. The used heatsink has a low-profile design and is made out of two metallic segments.
The IRDM Pro heatsink has a low-profile design, which makes the RAM kit ideal for most systems available, especially small form factor. In terms of height, the top side of the heatsink barely increases the overall height of the RAM module.
The label that offers the technical information of the RAM module is applied on the left side of each RAM stick. This particular label contains the serial number, type of RAM, the capacity of the module and the voltage. Unfortunately, the timings are not listed here.
The top of the heatsink has a straight design, with one side of the metal plate bent towards the center of the RAM module. This creates an overlapped design, as both sides of the heatsinks are bent one next to each other.
The bent edges of the heatsink feature the IRDM PRO name painted in a golden shade, which also has a brushed texture.
At the center of the heatsink, and on each side, the GOODRAM IRDM logo is placed, this graphical element has the same dark gold shade and features a linear brushed texture. The usage of a brushed texture is a great idea, as it contrasts with the matte finish of the black aluminum heatsink.
The removal of the heatsink is simple, with each side being held attached to the PCB by some self-adhesive thermal pads. However, in the case of the IRDM PRO, things went a bit different. This is a statement of how good the build quality is on these RAM kits, as one side of the heatsink was glued so hard that in the removal process, I managed to completely bend the aluminum heatsink.
I would like to point out that the damage is in no way the fault of GOODRAM nor a defective product. The damage was caused by the removal process, which boils down to the strength of the glue and my lack of patience.
Once both parts of the heatsink are removed, we see that the IRDM PRO modules have the memory chips on one side only. After a quick update and thanks to some of my readers, the actual model of the memory modules is now known. It appears that these chips are made by Hynix and are the model: H5AN8G8NCJR.
Hynix C-die 8Gb DRAMs.
Thanks!
The chips used are Hynix H5AN8G8NCJR, the DTBM code is a dead giveaway.
Thanks for letting me know! I ran the serial number through multiple search engines and software and got no return. I’ll update the article.
This DTBM thing is honestly confusing. I have ICs marked as such in 4GB OEM Goodram sticks, 8 banks per stick all on one side, and no clue whether it’s really “cut down” 8Gb CJR or something else. Apparently Hynix swaps the first letter for N (making it NTBM in thisbcase) for 4-bank configs and I’ve seen the second letter turning to W for 16-bank dualrank but that’s inconsistent (some still have a T there). Working on an extended version of the Hynix mark list right now (it already includes 8Gb MFR, AFR, CJR, DJR and JJR in a traditional 1024×8 config). And thanks a ton for the review anyway.