ASRock Inc. is established in 2002, specialized in the field of motherboards. ASRock strives to build up its own brand. With the 3C design concept, “Creativity, Consideration, Cost-effectiveness”, the company explores the limit of motherboards manufacturing while paying attention on the eco issue at the same time, developing products with the consideration of eco-friendly concept.


Official product link:

Packaging and accessories

The B365 Pro4 is delivered in a standard format cardboard box with a simple design.
The front side of the packaging features an abstract design and the name of the motherboard printed on the center. The Pro motherboard product series emblem is located on the upper side while the supported Intel processors are presented on the lower left corner.


The back of the packaging follows the standard structure, presenting in detail the motherboard and the I/O panel. The lower left side features the full technical specifications of the motherboard, with the right side presenting the main features of the product with full color images.


The sides of the box are simple in design. Here the name of the motherboard, Pro series and the ASRock logo are printed.



The product comes with the following accessories:
– 1x User manual
– 1x Support DVD
– 2x SATA Data Cables
– 3x Screws for M.2 Sockets
– 1x Standoffs for M.2 Sockets



MODEL: B365 Pro4
CPU SUPPORT: 9th and 8th Gen Intel® Core™ Processors
SOCKET: 1151
CHIPSET: Intel B365
– CPU: 6 Power Phase design
– Memory: 2 Power Phase design
FORM FACTOR: ATX 30.5 cm x 22.9 cm
– DDR4 2666 / 2400 / 2133 non-ECC, un-buffered memory
– Max. capacity of system memory: 64GB
BIOS: 1x 128Mb AMI UEFI Legal BIOS with GUI support
Expansion Slots:
– 2x PCI Express 3.0 x16 Slots (PCIE1/PCIE3: single at x16 (PCIE1); dual at x16 (PCIE1) / x4 (PCIE3)
– 2x PCI Express 3.0 x1 Slots (Flexible PCIe)
– 6x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0, RAID 1, RAID 5, RAID 10), NCQ, AHCI and Hot Plug
– 2x Ultra M.2 Socket (M2_1), supports M Key type 2230/2242/2260/2280 M.2 PCI Express module up to Gen3 x4 (32 Gb/s)
– 1x M.2 Socket (E-Key), supports type 2230 WiFi/BT module.
– 1x 2.5 Gigabit LAN 10/100/1000/2500 Mb/s (Giga PHY Intel I219V)
– 1x PS/2 Mouse/Keyboard Port
– 1x D-Sub Port
– 1x DVI-D Port
– 1x HDMI Port
– 2x USB 2.0 Ports (Supports ESD Protection)
– 1x USB 3.1 Gen1 Type-C Port (Supports ESD Protection)
– 5x USB 3.1 Gen1 Ports (Supports ESD Protection)
– 1x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED LED)
– HD Audio Jacks: Line in / Front Speaker / Microphone
AUDIO: 7.1 CH HD Audio with Content Protection (Realtek ALC892 Audio Codec)


– Premium 50A Power Choke
– 8 power phases Digital PWM
– Premium Memory Alloy Choke (Reduces 70% core loss compared to iron powder choke)
– ASRock Steel Slots
– ASRock Full Coverage M.2 Heatsink
– ASRock Ultra M.2 (PCIe Gen3 x4 & SATA3)
– Polychrome RGB
– High Density Glass Fabric PCB
– Sapphire Black PCB
– M.2 (KEY E) For WiFi
– ELNA Audio Caps
– Full Spike Protection

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4 thoughts on “ASRock B365 Pro4

  1. I would like to know if you have any ideas about adding some sort of cooling solution where a second heatsink would normally go at a right angle to the giant vrm one. I think all I could do is some sort of stick on solution as no holes are supplied to connect any sort of aluminum block type heatsink. I find it odd that they felt it was ok to not include one on this board when it’s on every other. Can you explain what their thoughts may have been. Also what is under the smaller thinner heatsink? Not the M2 one but the other. Thanks you for the review and hopefully any help you can offer.

    1. The best and cheapest way to provide some cooling for those VRMs is to add a small copper made heatsink that is using self adhesive thermal pads. You have plenty of choices, but make sure it is a self adhesive thermal pad or strip and not glue that you have to apply on the VRM.

      Their thoughts were simple, the motherboard was designed to be as cheap as possible for the end user, so they had to minimalize the cost of production without affecting the performance of the board.

      As for your question, if you mean the lower right heatsink, that is cooling the chipset of the motherboard.

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